This is an entry-level Process Engineer position in the Thin Films group at Skyworks in Woburn, MA. If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. Our work culture values diversity, social responsibility, open communication, mutual trust and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

The Process Engineering group at Skyworks in Woburn, Massachusetts is responsible for developing and supporting all wafer fabrication processes used to produce Skyworks' diverse portfolio of products.The primary device technologies include HBT, BiFET, BiHEMT, and pHEMT at various performance nodes.The group works closely with our Advanced Technology Development team in California to develop technologies and with the Manufacturing Operations team to deliver world-class quality products to market.

This Thin Films Process Engineer is an entry level position. The candidate is expected to have a good understanding of different thin film deposition techniques and semiconductor manufacturing. The primary job responsibilities include:

• Servesas process owner of one or multipledeposition tools such as Si diffusion, PECVD, sputtering, rapid thermal anneal, and e-beam evaporation. Develops thorough understanding of every aspect of the process, including qualifications, SPC, preventative maintenance, process parameters, and metrologies.
• Supports daily production to ensure on-time-delivery of top quality product. Occasionally requires leading a team to rapidly contain yield/quality excursions and drive corrective actions.
• Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications.
• Maintains process documentation to comply with quality and regulatory requirements, including process work instructions, process and materials specs, SPC charts, and FMEAs.
• Participates in fab-wide/section-specific continuous improvement efforts affecting key metrics.
• Supports Advanced Technology Development projects by developing and thoroughly characterizing robust unit processes as building blocks of next generation technologies.

• A Bachelor or Master degree in chemical engineering, material science, physics, chemistry, or related discipline.
• 1-3 years of experience in micro-electronics process engineering, including in an academic environment
• Fundamental understanding of thin film deposition and related processes, such as Si thermal oxide growth, LPCVD nitride deposition, DC/RF sputtering, PECVD, and thermal anneal.
• Some knowledge of testing and evaluation methods, such as profilometer, sheet resistance, XRF, SEM, TEM, ad SIMS.
• Excellent troubleshooting skills at system, process, and equipment levels.
• Some knowledge or practical experience applying SPC, DOE, and ANOVA.
• Metrics driven, data directed, and very strong in core engineering principles.
• Detail oriented and very organized.
• Ability to handle time sensitive projects and act with strong sense of urgency in a 24x7 manufacturing environment.
• Ability to produce thorough documentation that meets regulatory / methodology requirements.
• Ability to work effectively within a diverse team including engineers, technicians, operators, and quality controls, across various shifts.
• Ability and willingness to work in a cleanroom semiconductor processing environment.